BS EN 60068-2-83:2011

Overview

BS EN 60068-2-83:2011 outlines the methodology for solderability testing of electronic components specifically designed for surface mounting devices (SMD). This standard employs the wetting balance method using solder paste, providing a reliable assessment of solderability under controlled conditions. The document is crucial for manufacturers and quality assurance professionals aiming to ensure the reliability and performance of electronic assemblies.

Key Requirements

The standard specifies the following key requirements for conducting solderability tests:

• Test Methodology: The wetting balance method must be employed, which involves immersing the component lead in molten solder and measuring the wetting force over time.
• Test Conditions: Specific environmental conditions must be maintained, including temperature and humidity, to ensure consistent test results.
• Sample Preparation: Components must be prepared according to the guidelines to avoid contamination that could affect solderability.
• Measurement Criteria: The standard defines the criteria for evaluating the solderability, including the wetting time and the wetting force.

Implementation Benefits

Adhering to BS EN 60068-2-83:2011 provides several practical benefits for manufacturers and compliance professionals:

• Enhanced Product Quality: By ensuring components meet solderability requirements, manufacturers can reduce defects in solder joints, leading to improved product reliability.
• Streamlined Production Processes: Implementing this standard can help identify potential solderability issues early in the production process, allowing for timely corrective actions.
• Informed Supplier Selection: Compliance with this standard aids in evaluating and selecting suppliers based on their ability to provide components that meet solderability requirements.
• Market Competitiveness: Products tested according to this standard can demonstrate higher quality assurance, enhancing marketability and customer trust.

Compliance Value

Compliance with BS EN 60068-2-83:2011 is essential for organisations aiming to meet industry standards and customer expectations. The benefits of compliance include:

• Regulatory Adherence: Meeting this standard helps organisations comply with relevant regulations and directives, reducing the risk of penalties.
• Quality Assurance: Regular testing as per this standard reinforces quality assurance practices, ensuring that products are consistently manufactured to high standards.
• Risk Mitigation: By identifying solderability issues before they affect product performance, organisations can mitigate risks associated with product failures.
• Improved Customer Satisfaction: Delivering reliable products that meet or exceed expectations fosters customer loyalty and satisfaction.

In conclusion, BS EN 60068-2-83:2011 is a vital standard for ensuring the solderability of electronic components for SMD applications. By implementing the guidelines set forth in this standard, organisations can enhance product quality, streamline production processes, and ensure compliance with industry regulations.