BS EN 60191-6-17:2011
Explore BS EN 60191-6-17:2011, a vital standard for semiconductor packaging, ensuring quality and reliability in electronic components.
BS EN 60191-6-17:2011 - Comprehensive Standards for Semiconductor Packages
The British Standard BS EN 60191-6-17:2011 serves as a crucial framework in the realm of semiconductor packaging technology. This standard is part of a series that focuses on the mechanical and environmental performance of semiconductor packages. It details essential methodologies and criteria that ensure the reliability, quality, and safety of packaging solutions utilized in electronic components.
Published on June 30, 2011, this standard is classified under the ISBN 978 0 580 57621 8 and is offered at a competitive price of £220.00. The document addresses key aspects such as generalities, terminology, standardization processes, and relevant documentation needed for effective implementation of standard practices in semiconductor device packaging.
Key Features
- Identical to IEC 60191-6-17:2011: BS EN 60191-6-17:2011 is based on the same principles and provisions as its IEC counterpart, ensuring global consistency and compatibility across semiconductor packaging standards.
- Conformity with IEC TS 63019:2019: This standard aligns with the technical specifications set out in IEC TS 63019:2019, bolstering its relevance and applicability in modern semiconductor applications.
- Thorough Terminology: The standard includes comprehensive terminology that clarifies concepts and practices, facilitating clear communication and understanding among professionals in the industry.
Importance of Standardization
Standardization in the semiconductor industry is critical for fostering innovation and improving product performance. By adhering to BS EN 60191-6-17:2011, manufacturers can achieve uniform quality, enhance interoperability, and maintain compliance with regulatory standards. This leads to improved trust from end-users and stakeholders alike. Furthermore, the document plays a significant role in promoting a competitive marketplace where high-quality products can thrive.
With its comprehensive insights and practical applicability, BS EN 60191-6-17:2011 is an invaluable resource for engineers, technicians, and quality assurance professionals engaged in the design, development, and manufacturing of semiconductor devices. This standard not only defines best practices but also equips organizations with the tools necessary to advance their packaging technologies effectively.
For detailed information on procurement of the BS EN 60191-6-17:2011 standard, please refer to authorized distributors or obtain a copy in PDF or hardcopy formats, ensuring you stay ahead in this rapidly evolving industry.
Technical Information
Specification Details
- Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- Design guide for stacked packages
- Fine-pitch ball grid array and fine-pitch land grid…